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Profile
| Academic position | Full Professor |
|---|---|
| Research fields | Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering,Materials Engineering |
| Keywords | Atomic layer deposition (ALD) technique, Non-volatile memory technology, High-k dielectric/Metal gate stack, Low-k material and copper integration, MIM capacitors for RF and mixed signal application |
Current contact address
| Country | People's Republic of China |
|---|---|
| City | Shanghai |
| Institution | Fudan University |
| Institute | Department of Microelectronics |
Host during sponsorship
| Prof. Dr. Franz Faupel | Lehrstuhl für Materialverbunde, Christian-Albrechts-Universität zu Kiel, Kiel |
|---|---|
| Start of initial sponsorship | 01/12/2001 |
Programme(s)
| 2001 | Humboldt Research Fellowship Programme |
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Publications (partial selection)
| 2003 | Shi-Jin Ding, David Wei Zhang, Ji-Tao Wang, Wei William Lee: Chemical bonding of magnetron-sputtered copper on PECVD amorphous SiCOF film . In: Applied Surface Science, 2003, 321-330 |
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| 2003 | S.-J. Ding, V. Zaporojtchenko, J. Kruse, J. Zekonyte, F. Faupel: Investigation of the interaction of evaporated aluminum with vapor deposited Teflon AF films via X-ray photoelectron spectroscopy . In: Applied Physics A: Materials Science & Processing, 2003, 851-856 |