Dr. Siwei Bai

Profile

Academic positionPost Doc
Research fieldsMedical Physics, Biomedical Engineering
Keywordscochlear implant, computational modelling, biomedical engineering

Current contact address

CountryGermany
CityGarching
InstitutionTechnische Universität München
InstituteFachgebiet Bioanaloge Informationsverarbeitung

Host during sponsorship

Prof. Dr.-Ing. Werner HemmertFachgebiet Bioanaloge Informationsverarbeitung, Technische Universität München, Garching
Start of initial sponsorship01/03/2016

Programme(s)

2015Humboldt Research Fellowship Programme for Postdocs