Dr. Sai Raja Gopal Vadlamudi

Profile

Academic positionPost Doc
Research fieldsChemical and Thermal Process Engineering,Mathematics in fluid mechanics
KeywordsMicrolayer dynamics, Mechanistic modeling of boiling, Boiling heat transfer, Sliding vapor bubble

Current contact address

Host during sponsorship

Prof. Dr.-Ing. habil. Dr. h.c. mult. Uwe HampelInstitut für Fluiddynamik, Helmholtz-Zentrum Dresden-Rossendorf (HZDR), Dresden
Start of initial sponsorship01/10/2023

Programme(s)

2023Humboldt Research Fellowship Programme for Postdocs