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Profile
| Academic position | Full Professor |
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| Research fields | Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering,Thermodynamics and Kinetics as well as Properties of Phases and Microstructure of Materials |
| Keywords | Flip Chip, Lead-free Solder, Interfacial Reaction, Reliability, Electronic Packaging |
Current contact address
| Country | People's Republic of China |
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| City | Dalian |
| Institution | Dalian University of Technology |
| Institute | School of Materials Science and Engineering |
Host during sponsorship
| Prof. Dr.-Ing. Herbert Reichl | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Institutsteil Berlin, Berlin |
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| Start of initial sponsorship | 01/05/2004 |
Programme(s)
| 2003 | Humboldt Research Fellowship Programme |
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Publications (partial selection)
| 2006 | M.L. Huang, T. Loeher, D. Man, L. Bottcher, A. Ostmann, and H. Reichl: Morphology and growth kinetics of intermetallic compounds in solid state interfacial reaction of electroless Ni-P with Sn-based lead-free solders. In: Journal of Electronic Materials, 2006, 181-188 |
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| 2005 | M. L. Huang, T. Loeher, A. Ostmann, and H. Reichl : Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders . In: Applied Physics Letters, 2005, 181908 -3 |