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Profile
| Academic position | Full Professor |
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| Research fields | Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering |
| Keywords | Advanced microsystem packaging , New electronic packaging materials , Reliability of electronic product and package |
Current contact address
| Country | People's Republic of China |
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| City | Beijing |
| Institution | Chinese Academy of Sciences (CAS) |
| Institute | Institute of Microelectronics, System Packaging Center |
Host during sponsorship
| Dr.-Ing. Hermann Oppermann | Photonic and Power System Assembly, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Institutsteil Berlin, Berlin |
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| Start of initial sponsorship | 01/03/2006 |
Programme(s)
| 2005 | Humboldt Research Fellowship Programme |
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Publications (partial selection)
| 2008 | D. Q. Yu, H. Oppermann, J. Kleff, M. Hutter: Interfacial Metallurgical Reaction between Small flip-Chip Sn/Au Bumps and thin Au/TiW UBM under Multiple Reflow . In: Scripta Materialia, 2008, 606-609 |
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