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Current contact address
| Country | People's Republic of China |
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| City | Dalian |
| Institution | Dalian University of Technology |
| Institute | School of Materials Science and Engineering |
Profile
| Research fields | Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering,Thermodynamics and Kinetics as well as Properties of Phases and Microstructure of Materials |
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| Keywords | Flip Chip, Lead-free Solder, Interfacial Reaction, Reliability, Electronic Packaging |